ICMCTF2011 Session F2-2: High Power Impulse Magnetron Sputtering
Time Period FrM Sessions | Abstract Timeline | Topic F Sessions | Time Periods | Topics | ICMCTF2011 Schedule
Start | Invited? | Item |
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8:00 AM | Invited |
F2-2-1 The influence of High Power Impulse Magnetron Sputtering (HIPIMS) Pulse Parameters on Plasma, Target and Substrate Interactions for Chromium
Frank Papa (Hauzer Techno Coating, BV, Netherlands); Holger Gerdes, Ralf Bandorf (Fraunhofer IST, Germany); Arutiun Ehiasarian (Sheffield Hallam University, UK); Ivan Kolev, Roel Tietema (Hauzer Techno Coating, BV, Netherlands); Geunter Braeuer (Fraunhofer IST, Germany); Thomas Krug (Hauzer Techno Coating, BV, Netherlands) High Power Impulse Magnetron Sputtering (HIPIMS) has been of great interest over the past decade. It's main benefit being that at least some of the sputtered target material can be ionized. Due to this ionization, it is possible to modify and tailor coating properties in ways which are not easily possible with DC magnetron sputtering. There still exist, however, many questions concerning the relationships between peak pulse energy and the resulting degree of ionization and the ion/deposited particle ratio at the substrate. Since the main mechanism for ionization is electron impact ionization, it is expected that the degree of ionization will increase linearly with peak cathode current. This is though, only one side of the equation. Magnetic field strength greatly influences the discharge characteristics and deposition rate. In turn, this changes the nature of the ion/deposited particle interaction at the substrate. In this study, peak cathode current has been held as the control variable. Around this control, the magnetic field strength, pulse length and degree of pre-ionization have been varied. Pulses of 500-1000µs were characterized with a peak cathode current density between 0.1-1 A/cm2 for chromium. Time resolved optical emission spectroscopy was used to examine the evolution of ionized species during the pulse. Density corrected deposition rate measurements were made in order to determine the deposition rate per pulse segment as related to pulse energy. A biased probe was used to collect the ion flux at the substrate position. From these measurements, the ion/deposited particle ratio has been calculated. The microstructure of the coatings deposited under the various conditions is also examined. It has been found that there is a strong relationship between the pulse shape and the resulting plasma composition and deposition rate due to the spatial evolution of HIPIMS plasmas. |
8:40 AM |
F2-2-3 A Comparison of PET Plasma Pre-Treatment Using Medium Frequency and Low Frequency-High Power Pulse Oxygen-Containing Discharges
Martynas Audronis, Victor Bellido-Gonzalez (Gencoa Ltd, UK); Steve Hinder, Mark Baker (University of Surrey, UK); Allan Matthews (University of Sheffield, UK) Vacuum web coating is an important manufacturing process that is used to produce technological thin films for a wide variety of applications, such as solar cells, displays and solid state lighting. Thin film adhesion to the polymer web is one of most important quality characteristics of a coated product. It can be improved significantly by web plasma pre-treatment methods, which are now used routinely in roll-to-roll coating systems. Magnetically enhanced plasma treatments are established processes to enhance quality and performance of plasma processed and/or vacuum coated web products. In this paper we present results on flexible polymeric substrate (PET) pre-treatment using a method comprising a magnetically enhanced plasma powered by either a) medium frequency (50-250 kHz) or b) low frequency (50-300 Hz) high power (HIPIMS) sources. Plasma pre-treatment processes are carried out in Ar – O2 atmosphere. The effects of different pre-treatments on the surface properties are investigated by XPS, ToF-SIMS and AFM and compared. |
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9:00 AM |
F2-2-4 Growth of HfO2-Based High-k Dielectric Films by High Power Impulse Magnetron Sputtering
Kostas Sarakinos, Bo Lü, Hans Arwin (Linköping University, Sweden); Stephanos Konstantinidis (CIRMAP, University of Mons, Belgium); Moritz to Baben, Denis Music, Jochen Schneider (RWTH Aachen University, Germany); Ulf Helmersson (Linköping University, Sweden) Hafnium dioxide (HfO2) films are widely used as dielectric layers in microelectronic devices. Among the various polymorphs of HfO2 the high temperature cubic (c) and tetragonal (t) phases are of importance since they exhibit significantly larger dielectric constant (k) as compared to the low temperature monoclinic (m) HfO2 configuration. In the present study we grow films at room temperature by sputtering a metallic hafnium target in a reactive Ar-O2-N2 atmosphere employing high power impulse magnetron sputtering (HiPIMS). The deposition process exhibits a stable transition zone between the metallic and the compound sputtering mode which enables to tune the composition of the target surface (target coverage) by varying the partial pressures of the sputtering gases. The well defined target coverage conditions, in turn, facilitate control over the non-metal sublattice configuration of the growing hafnium oxynitride (Hf-O-N) films in terms of N and O incorporation. Structural characterization tools are employed to define deposition conditions that lead to the growth of films with the HfO2 crystal structure. Experimental data and first principle calculations suggest that N incorporation and O vacancies favor the formation of the c- and the t-HfO2 crystal structure at the expense of the m-HfO2 one [1]. Optical analysis employing spectroscopic ellipsometry in the near-infrared to ultra-violet spectral range indicates that Hf-O-N films with the crystal structure of c- and t-HfO2 exhibit larger dielectric constants as compared to films with the m-HfO2 structure.
[1] K. Sarakinos et al., J. Appl. Phys. 108 (2010) 014904 |
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9:20 AM |
F2-2-5 Growth of V-Al-C Thin Films by HPPMS and DC Magnetron Sputtering Using a Multi-Component Target
Yan Jiang, Stanislav Mraz, Tetsuya Takahashi (RWTH Aachen University, Germany) V-Al-C thin films were deposited onto Al2O3 (11-20) substrates by HPPMS and DC magnetron sputtering using a hot-sintered multi-component target with 2:1:1 MAX phase-like composition. The film composition was found to be a strong function of the deposition pressure and target-to-substrate distance. The formation of crystalline phases with the close-to-MAX-phase-like composition was investigated as a function of the substrate temperature, from room temperature up to 500°C, and duty cycle, from 1.7 % to 20 %, respectively. Al-containing hexagonal vanadium carbide was formed during both DC and HPPMS at 500°C, where the lattice parameter of the hexagonal solid solution was dependent on the duty cycle employed during HPPMS. The change in c lattice parameter comparing DC sputtering with HPPMS at a duty cycle of 5 % is with 2.6 % rather extensive and appears to be primarily affected by the ion bombardment by film forming species. Plasma composition analysis data supports this notion. The here presented data are of relevance for understanding the mechanisms that govern the growth of MAX phase thin films at low substrate temperatures. |
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9:40 AM |
F2-2-7 Rotatable Magnetron Sputtering of Aluminium in Continuous and Pulse Modes Using Different Strength Magnetic Arrays
Martynas Audronis, Victor Bellido-Gonzalez, Robert Brown (Gencoa Ltd, UK) Sputter target utilisation and film deposition rate are the two characteristics that affect the productivity of a sputter-based vacuum coating manufacturing processes most significantly. Hence, these characteristics are important when selecting a deposition method. Sputter cathode manufacturers are constantly striving to improve the target utilisation and maximise the deposition rate. On the other hand efforts are made to improve properties of existing coatings and develop new. Power supply technologies have played a major role in aiding film property improvements (e.g. arc free operation in medium frequency AC power mode for fabrication of insulating oxide films). High Power Impulse Magnetron Sputtering (HIPIMS) is one such recently developed power supply technology that holds a promise to enhance many thin film material systems. In general, it is known that HIPIMS exhibits relatively low deposition rates as compared to Direct Current (DC) sputtering processes. In this paper we present preliminary results of industrial size (150 mm target O.D.) rotatable magnetron sputtering of aluminium target in continuous and pulse (HIPIMS) modes using standard commercially available magnetic arrays, such as a normal strength array (e.g. as used for DC and AC processing) and an ‘RF’ array (i.e. as commonly used for RF rotatable magnetron sputtering). A comparison is made in terms of magnetic field distribution, process characteristics and deposition rates. It is shown that deposition rates using HIPIMS and one of the commercially available magnetic arrays can be as high as those obtained when operating in DC mode. |