ICMCTF1998 Monday Morning
Sessions | Time Periods | Topics | Schedule Overview
Hover over a paper or session to view details.
Click a Session in the first column to view session papers.
Session | Monday, April 27, 1998 | |||||||||||
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8:30 AM | 9:30 AM | 10:30 AM | 11:30 AM | |||||||||
B1 |
Plenary Lecture
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Plenary Lecture
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Plenary Lecture
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Plenary Lecture
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Reactive Sputter Deposition of TiN/C-N and NbN/C-N Nanostructured Multilayers
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Growth and Mechanical Properties of CNx / BN:C Nano-Scaled Layered Coatings by Unbalanced Dual Cathode Reactive Magnetron Sputtering
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Reactive Sputtering of Nanometer-Scale Multilayer Coatings
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Deposition And Characterization of Multi-layered TiN/TiAlN Coatings By Unbalanced Magnetron Sputtering
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C1 |
Plenary Lecture
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Plenary Lecture
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Plenary Lecture
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Plenary Lecture
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Fiber Optic IR Screen Projector
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Implementation of Micromirror Arrays as Optical Binary Switches and Amplitude Modulators
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D1 |
Plenary Lecture
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Plenary Lecture
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Plenary Lecture
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Plenary Lecture
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The Dependence of c-BN Film Growth on Ion Energy Distribution in a Low Density, Arcjet-produced Plasma Flow
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Evidence for the Formation of Crystalline sp3-Carbon-containing Carbon Nitride Thin Films
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Properties of Carbon Nitride Films Deposited by Magnetron Sputtering
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c-BN Formation by RF Capacitively Coupled PECVD from BCl3
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Microstructure, Bonding Configurations and Mechanical Properties of Magnetron Sputtered CNx (0 ≤ x ≤ 0.5)
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E1 |
Plenary
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Plenary
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Plenary
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Plenary
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Surface Modification Methods for Reducing Stiction in Microelectromechanical Systems
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Lubrication Mechanisms in Zinc Oxide Coatings
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Influence of Doping and Substrate Texture on the Growth of Lubricious Zinc Oxide Thin Films
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Tribological Evaluation of PVD WC/C Low-Friction Coatings
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G1 |
Plenary
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Plenary
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Plenary
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Plenary
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Plasma-Enhanced, Magnetron-Sputtered, Deposition (PMDTM) of Materials
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Self-Propagating High Temperature Syntehsis (SHS) Process Application for Thin Films and Coating Deposition
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Advanced Electron Beam Installation for Coating Gas Turbine Blades
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H7 |
Plenary
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Plenary
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Plenary
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Plenary
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Manufacturing Aspects of 300-mm Process Technology
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Properties of Silicon Wafers as 300-mm Substrates
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Factors Affecting the Design of Physical Vapor Deposition Sources for 300mm Diameter Wafers
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