ICMCTF1998 Advanced Materials in Microelectronics Sessions
Topics | Time Periods | Schedule Overview
Click a Session Code to view its Abstracts
| Session Code | Start | Session Name |
|---|---|---|
| H7- | Monday, April 27, 1998 8:30 AM | Technological Challenges of 300mm IC Substrates |
| H6- | Monday, April 27, 1998 1:30 PM | Interconnect Integration |
| H4- | Tuesday, April 28, 1998 8:30 AM | Silicides |
| H5- | Tuesday, April 28, 1998 1:30 PM | Silicon Contact Tehnology |
| H1- | Wednesday, April 29, 1998 8:30 AM | Advanced Metalization: Materials and Processes |
| H1-2- | Wednesday, April 29, 1998 1:30 PM | Advanced Metalization: Materials and Processes (2) |
| HP- | Wednesday, April 29, 1998 5:00 PM | H - Posters |
| H2- | Thursday, April 30, 1998 8:30 AM | Advanced Dielectrics and Planarization: Materials and Processes |
| H3- | Thursday, April 30, 1998 1:30 PM | Chemical Mechanical Polishing |