AVS2003 Monday Afternoon
Sessions | Time Periods | Topics | Schedule Overview
Hover over a paper or session to view details.
Click a Session in the first column to view session papers.
Session | Monday, November 3, 2003 | ||||||||||
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2:00 PM | 3:00 PM | 4:00 PM | 5:00 PM | ||||||||
AP-MoA |
Nanotechnology: A Policy Perspective
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Nanotechnology: Future Challenges and Opportunities
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Self-Assembly Processing for Nanomanufacturing
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Nanotechnology: Constructing a Computer from Molecular Components
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Massively Parallel Assembly
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AS-MoA |
Vibrational Behavior of Adsorbed CO2 on the Interior and Exterior Surfaces of Carbon Nanotubes: An Experimental and First Principles Study
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Adsorption and Dimerization of NO Inside of Single Walled Carbon Nanotubes - An Infrared Spectroscopic Study
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Adsorption of CF4 on Opened Single Walled Carbon Nanotubes
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Sidewall Chemistry of Carbon Nanotubes Investigated by STM
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Iron-Oxide Nanoparticle Stability in an Ion Beam
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Scanning Tunneling Spectroscopy of Boron Nitride Nanotubes; Evidence for a Giant Stark Effect
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Size Dependency of Structural, Optical, and Photocatalytical Properties of TiO2 Nanoparticles
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Determination of the Fermi Level of Isolated Single-Walled Carbon Nanotubes in Solution
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Band Modulation in Various Nanopeapods and Its Origin
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BI-MoA |
Towards the Prevention of Protein Adsorption, and Bacterial and Cell Adhesion by Optimised Surface Modification
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Factors that Determine the Protein Resistance of Oligoether Self-assembled Monolayers - Internal Hydrophilicity, Terminal Hydrophilicity and Lateral Packing Density
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Use of QCM-D to Analyze Thin Polymer Films at Interfaces
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Non-Fouling Surfaces: Their Use and Study by Matrix-Assisted Laser Desorption / Ionization Mass Spectrometry
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Comparison of Immunoassay Blocking Strategies on Metal Oxide Substrates
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Lubricating with Water: Biomimetic Additives
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Boundary Lubrication Properties of Bio- and Synthetic Polymers Containing Poly- and Oligosaccharides
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The Role of Polysaccharides in Bacterial Adsorption: A Chemical Perspective
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DI-MoA |
Etching and Thermal Stability of Zirconium and Hafnium Oxide High-k Dielectrics
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Structure and Stability of Alternative High-K Gate Dielectrics
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Hafnium Silicate High-K Dielectric Etch with High Selectivity to Si at Low Wafer Temperatures
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Post Deposition Stability of High-k Dielectrics to Air Exposure and its Implications to Interface Reactivity
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Growth, Characterization and Thermal Stability of High-K Gate Stacks
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Hafnium Germanosilicate Thin Films for Gate and Capacitor Dielectric Applications: Thermal Stability Studies
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EM+ |
Localized Defect States, Impurities, and Doping in AlxGa1-xN Epilayers
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Contactless Characterization of High Electron Mobility Transistor Structures using Surface Photovoltage Spectroscopy
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Atomic Bonding and Electronic Changes at InGaAs/InP Heterojunctions
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Nanoscale Electronic Characterization of Semiconductors: from Operating Devices to Atomic Scale Defects
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STM Observation of Subsurface Boron Dopants on the Si(001)-2x1 Clean Surface
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Surface Defects After the Growth of Highly P and Sb Doped Si
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The Effect of Strain on Impurity States in Si and Methods of Calculation Thereof
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New Mechanism for Coupling between Properties of Interfaces and Bulk Semiconductors
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MI-MoA |
Materials/Structures for High Areal Density Write Poles
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Influence of Pd and Pt Buffers on the Soft Magnetic Properties of Fe70Co30 Thin Films
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Atomistic Simulations of Metal/Metal Oxide Heterostructures
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Quantum-size Effect of Tunneling Magnetoresistance in Magnetic Tunnel Junctions
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Magnetization Dynamics and Magneto-transport in Epitaxial Nano-structures
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Artifacts in Ballistic Magnetoresistance Measurements
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Arrays of Magnetoresistive Sensors for Non-destructive Testing
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MS-MoA |
Research and Challenges in Nano Mechanics and Materials
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Opportunities and Challenges in the Materials Supply Chain for Semiconductor Manufacturing
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New Processes and Materials for Environmentally Benign Semiconductor Manufacturing
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Sub-100 nm Copper Wiring Challenges and Solutions
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Nanoporous Organosilicates for On-Chip Applications Using Sacrificial Macromolecular Porogens
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OM-MoA |
Characterization of Organic-Metal and Organic-Organic Interfaces
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The Role of Charge Neutrality Level in Molecular Level Alignment at All-organic Heterojunctions
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Au/CuPc Interface: A Photoemission Investigation
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XPS and HRSEM Studies on the Interfaces of Au/CuPc vs. Au/FCuPc
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A Combined Photoemission Spectroscopy and Scanning Probe Microscopy Study of Organic Charge Injection Layer / Metal Interfaces
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Electronic Structures of Al/Liq/Alq3 Interfaces Studied by Photoemission Spectroscopy
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Direct Observation of the Evolution of the Molecular Orbital Energy Levels of a Silole Derivative as a Function of Magnesium Deposition
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Band Alignment on Patterned Surfaces
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A General Soft Contact Evaporation Method for Molecule-Based (Opto) Electronic Devices
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PS-MoA |
Ion-Acoustic Solitons in a High Power Pulsed Magnetron Sputtering Discharge
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Next Generation RF Ion Beam Source for Three-Dimensional and other Critical Etching Applications
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The Use of Reactive Gases with Broad-beam RF Ion Sources for Industrial Applications
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Reactive Sputter Deposition of Nanocrystalline Compound Thin Films with a Hollow Cathode Source Operated in a Static Mode
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Evolution of Radiofrequency Plasma Sources
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Physics of High-pressure Helium and Argon Plasmas
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Two-dimensional Self-consistent Modeling of Wave Propagation and Plasma Dynamics in a Helicon Source
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Large Area Electron-Beam Generated Plasma Processing System1
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Post-etch Wafer Cleaning by a New Dry-cleaning Technique using Both Gas Flow and Plasma
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PS+ |
Understanding Deep Silicon Etching: Mechanisms for Formation and Removal of Sidewall Passivation
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Improvement of Anisotropy and Aspect Ratio of a Pattern Etched in Bosch Process by using a Faraday Cage
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Exploring Microdischarges for Manufacturing and Sensing Applications
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Feature Scale Model of Etching High Aspect Ratio Structures in Silicon using SF6/O2 Plasma
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Etching of High Aspect Ratio Structures in Si using SF6/O2 Plasmas
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Via Drilling on Silicon Wafers using the Cryogenic Process
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Si, SiO2 Feature Etching for MEMS Fabrication: A Combined Simulator Coupling Local Transport, Surface Etch, and Profile Evolution Models
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In-Situ On-wafer Monitoring for Charge Build-up Voltage during Plasma Process
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Plasma Etching of Chromium as a Hard Mask for a Complex Metal Stack Etch
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QS-MoA |
Metrology Needs for Ultrathin Films in the Wafer Processing Industry. What is Needed? What is Available?
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Intercomparison of Silicon Dioxide Thickness Measurements Made by Multiple Techniques - The Route to Accuracy
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Comparative Thickness Measurements of SiO2/Si Films for Thicknesses less than 10 nm
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The Thickness and Composition of Ultra-thin SiO2 Layers on Si
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Characterization and Metrology for High k Materials using Parallel Angular Resolved XPS (PARXPS)
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Multivariate Statistical Analysis of Spatially Compressed Time-of-Flight Secondary Ion Mass Spectrometry Images1
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SE-MoA |
High-resolution TEM Study the Microstructure of W-Si-C Films in the Vicinity of the Crystalline-Amorphous Transition
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Metrology of 1-10 nm Thick CNx Films: Thickness, Density and Surface Roughness Measurements
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Reactive Magnetron Sputtering of Hard Si-C-N and Si-B-C-N Films and Their Properties
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Using NMR to Probe the Bonding in Amorphous Carbon Nitride Thin Films
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DLC and CNx Coatings Produced by Pulsed Laser and Filtered Vacuum Arc Techniques
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Fabrication and Properties of Ultra-nano, Nano, and Polycrystalline Diamond Membranes and Sheets
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Nanotribological Properties of Nanocomposite and Amorphous CrBN Thin Films
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SS1-MoA |
Growth of Ordered and Disordered Arrays of Silicon Pillars During Laser-Assisted Etching
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Defect-driven Photodesorption at UV and VUV Excimer Laser Wavelengths
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Hot Electron Generation and Detection from Chemical Reactions on Metal Surfaces
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Factors Influencing Ion Yields and Angular Distributions in Electron Stimulated Desorption
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Effects of Water Ice Films on Thermal Stability and Electron-activated Decomposition of CF2Cl2 on Metal Surfaces
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Water Enhanced Decomposition and Nanometer Scale Structure Formation Generated by Radiative Exposure of Solid Surfaces
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Electron-stimulated Reactions in Thin Amorphous Solid Water Films on Pt(111).
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Temperature-Dependent Thresholds for Ion-Stimulated Surface Diffusion: Experiments with Second Harmonic Microscopy
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Femtosecond Photo-generated Carrier and Reaction Dynamics on a Chlorinated Silicon Surface: Reaction Yield Calculation by Rate Equation of Adsorbed Chlorine
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SS2-MoA |
Super Hydrophobic Interactions: From the Inside and Out
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Friction Anisotropy at Pd(100)/Pd(100) Interfaces
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Direct Observation of Superlubricity
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The Role of the Third Body Processes in the Friction and Wear of MoS2 and MoST Coatings
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Molecular and Bulk Material Mechanisms of Smooth and Stick-slip Sliding
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Evaluation of the Surface Characteristics and Mechanical Properties of Interconnect Films and their Correlation with CMP Process
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A Comparative Study of the Adhesion, Friction, and Mechanical Properties of CF3 and CH3 Terminated Alkanethiol Monolayers
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Reaction of Trimethylphosphate with TiC and VC(100) Surfaces
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Degradation of Self-Assembled Monolayer in Humid Environments
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SS3-MoA |
Catalysis by Supported Metal Nanoclusters
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Gold Nano-Clusters on Rutile TiO2(110) - A Combined UHV and High Pressure STM Study
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Dimethyl Methylphosphonate Decomposition on Supported Ni Nanoparticles Deposited on a TiO2(110) Surface
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Dynamics and Chemical Reactivity of Au on TiO2 (110) Rutile
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Oxygen-Induced Morphological Changes in Cu and Ni Islands on TiO2(110)
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Chemical Reactions on Free Iridium and Platinum Clusters
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STM Study of Copper Growth on ZnO(0001)-Zn and ZnO(0001bar)-O Surfaces
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Charge Exchange between Alkali Ions and Nanocrystal Metal Surfaces
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Electronic Detection of Oscillatory Reactions on Supported Platinum Particles
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TF-MoA |
The Application of Plasma for Metal Atomic Layer Deposition for Cu Interconnect Technology
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Copper Atomic Layer Deposition Using In Situ-Generated Cu3Cl3 and Hydrogen Radicals
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Dynamic Equipment and Process Simulation for Atomic Layer Deposition Technology
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Al2O3 Atomic Layer Deposition for the Enhancement of MEMS Performance and Reliability
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Processes and Properties of Porous CVD Low-k Materials
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Deposition of Low k OSG Films Exhibiting Enhanced Mechanical Properties by PECVD
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Expanding Thermal Plasma for Low-k Dielectrics: Guiding the Film Chemistry by Means of Selected Dissociation Paths in the Plasma
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Photoresist Removal on Porous Low-k Materials Using an Energetic (100s of eV) Oxygen Neutral Beam
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