ICMCTF2013 Session Ex: Exhibition Keynote Lecture

Plasma-enhanced chemical vapor deposition (PECVD) is a well-known, easy-to-implement solution for the development of thin-film materials. The method allows fine-tuning of their properties and has minimal environmental impact. Replacement of conventional low-pressure plasma systems by in-line atmospheric pressure (AP) would be a solution for the increasing demand for fabrication of products with improved functionality at low cost. Over the past ten years, the expansion of atmospheric pressure plasma solutions for surface treatment of materials has been remarkable. New plasma sources and new reactors have been developed. At the laboratory scale, dense, porous, nanostructured thin films have been realized. These materials can be used as barrier layers, superhydophobic or antifog coatings, antireflective and passivating layers for crystalline solar cells, and for bio applications. New plasma sources, suitable for linear configuration and thus allowing large-area surface treatment, will be described and compared with respect to growth rate and thin-film properties. Challenges related to industrial process upscaling will be addressed. Current developments such as co-injection of nano-powders with liquid or gas thin-film precursors for fabrication of nanocomposites will be discussed.