AVS 71 Session SE-ThP: Advanced Surface Engineering Poster Session

Magnetron sputtering remains a premier thin‐film deposition technique, with its performance critically dependent on the spatial relationship between magnetron cathodes and the target–substrate assembly. In this review, we collate experimental findings from the literature into three principal geometric classifications: sputter‐up versus sputter‐down magnetron orientations, planar versus confocal magnetron arrangements, and on‐axis versus off‐axis substrate positioning.

For each geometric class, we assess how the arrangement influences plasma confinement, governs the angular dispersion of sputtered species, and ultimately controls key film attributes—including mass density, residual stress, microstructural development, and step‐coverage uniformity. By establishing quantitative correlations between spatial parameters and these film properties, we formulate a design‐oriented framework to aid researchers in choosing the optimal magnetron configuration for targeted material performance.

To demonstrate practical application, we highlight state‐of‐the‐art deposition chambers and magnetron source designs that permit rapid, tool‐free reconfiguration of source–substrate geometry. Such adaptable platforms enable real‐time tuning of deposition conditions, granting precise control over thin‐film growth in situ.