AVS 68 Tuesday Afternoon
Sessions | Time Periods | Topics | Schedule Overview
Hover over a paper or session to view details.
Click a Session in the first column to view session papers.
Session | Tuesday, November 8, 2022 | |||||||||||
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2:20 PM | 3:20 PM | 4:20 PM | 5:20 PM | |||||||||
2D+ |
Strategies for Controlling Structure and Magnetic Texture in 2D Magnets
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Bidirectional Phonon Emission in van der Waals Heterojunctions During Ultrafast Charge Transfer
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BREAK
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Understanding Structural, Chemical, and Number of Layer-Dependent Properties in 2D Lateral and Vertical Structures for Subsequent Optical Measurements
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Determination of Band Offsets in Semiconductor Heterostructures (2D/3D) by Using XPS
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Investigation of a Novel Layer-by-Layer Growth Methodology for Surface Metal-Organic Frameworks
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AP+ |
Thermal Atomic Layer Etching: The Right Etch Technology at the Right Time
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Atomic Layer Etching of Titanium Nitride with Surface Modification by Cl Radicals and Rapid Thermal Annealing
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Thermal Atomic Layer Etching (ALE) of Metal Oxides by Chlorination and Ligand Addition using SO2Cl2 and Tetramethylethylenediamine (TMEDA)
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BREAK
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Thermal Atomic Layer Etch Processes in Semiconductor Manufacturing Challenges and Opportunities
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Thermal Atomic Layer Etching (ALE) of InGaP:Processing Chemistry and Removal of Surface Defects
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Thermal Atomic Layer Etching of MoS2 Films
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Atomically-Precise Surface Processes: From Molecular Mechanisms to Realistic Devices
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Deposit and Etchback Approach for Ultrathin and Continuous Films Using Atomic Layer Deposition and Atomic Layer Etching
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AS+ |
Origins of the Emergent Phenomena at Oxide Interfaces Studied with Complementary X-Ray Spectroscopic and Scattering Techniques
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Multi-Technique Forensic Analysis by Co-Incident XPS & Raman Imaging
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Comparison of Methods to Quantify Silicone on Hair
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BREAK
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Progress Towards Atomic Scale Analytical Tomography
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Investigating 2d-Materials Using Correlative Spectroscopy & Microscopy
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Surface Analysis in Fujifilm Electronic Materials Research & Development Laboratory: Applications on Chemical Mechanical Planarization
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Investigating GeTe as an Ovonic Threshold Switch with Spectroscopic and Electronic Techniques
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Multi-Technique Analysis of Organic and Inorganic Semiconductors for Composition and Electronic Information
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CA+ |
Understanding Charge Carrier Variations on the Nanoscale Using Microwave Near-Field Microscopy
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Oxidation/Reduction of Cu Nanoparticles at a Single-Layer Graphene/Electrolyte Interface Monitored by Scanning Kelvin Probe Microscopy
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Investigation Tritium and Lithium transport along the Tritium-Producing Burnable Absorber Rod
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BREAK
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Development of a Workflow for Multiscale Elemental Analysis with X-ray Fluorescence Microscopy and Tomography
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in Situ Molecular Imaging of Green Solvents for CO2 Capture
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Depth Dependence of Salt Ions at the Liquid/Vapor Interface Studied by Ambient Pressure X-Ray Photoelectron Spectroscopy
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EL1+ |
Terahertz to Vacuum Ultraviolet Ellipsometry Characterization of Spin, Lattice, Strain, Free Charge Carrier, Dielectric Constants, Exciton and Band-to-Band Transition Properties in Ultrawideband Gap Alpha and Beta Aluminum Gallium Oxide Semiconductor Alloys
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EL2+ |
BREAK
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A Study of Wire Grid Polarizers with Mueller Matrix Ellipsometry
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Temperature Dependence of the Direct Band Gap of InSb from 80 to 700 K
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Coherent Acoustic Phonon Oscillations in Ge Using Pump-Pulse Time-Resolved Spectroscopic Ellipsometry
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Time-Resolved Spectroscopic Ellipsometry Helped by Imaging Spectroscopic Ellipsometry
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HC+ |
Fundamental Studies of C1 Catalysis on Metal-oxide and Metal-Carbide Interfaces
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Atomic Scale Studies of Chromium Species on Iron Oxide Surfaces
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Investigation of CO Oxidation on Oxygenated Rh(111) Surfaces with RAIRS
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BREAK
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Molecular Beam Surface Reaction Experiments with Chiral Molecules
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A Local View on the Influence of Solvent and Product on the Reactivity of Surface-Catalyzed Reactions
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Enhanced Catalytic Selectivity Due to Topographically Reduced Work Function of Carbon Nanospikes
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HC Graduate Student Finalist Talk: Enhanced Descriptor Identification and Mechanic Understanding for Catalytic Activity using Data-Driven Framework: A Case Study of CO Hydrogenation over Cu-Based Single Atom Alloys
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LS1+ |
In-situ/Real-time XPS Study of Electrochemical Reactions in All-solid-state Thin-film Lithium-Ion Batteries
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Interaction of Molecular Nitrogen with Vanadium Oxide in the Absence and Presence of Water Vapor at Room Temperature: Near-Ambient Pressure XPS
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Catalysts Caught in the Act: an Operando Investigation of Copper during CO2 Hydrogenation
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BREAK
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LS2+ |
BREAK
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Visualizing Complex Many-Body Phenomena in 2D Materials Based Heterostructures and Devices
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Dynamic Grating Development for Neutron Imaging Across Multiple Length Scales
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Dynamics, Stability and History-Dependence of Magnetic Skyrmions in the 2D van der Waals Magnets FexGeTe2
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MI-TuA |
Evidence of Antiferromagnetic Coupling between Topological and Magnetic Insulators
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Infrared Magnetospectroscopy of Magnetic Topological Insulator Heterostructures
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BREAK
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Topological States in the van der Waals Magnet MnBi2Te4: from 3D to 2D
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Rashba-Type Splitting of the Au(110) Surface State: A Combined Inverse and Direct Photoemission Study
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Spin-Polarized Resonant Tunneling - a New Tool for Sensing and Manipulating Magnetism on the Atomic Scale
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PS1+ |
Study of Residues Formation after Ge-Rich GST Etching Using Halogen Gases
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Magnetron Plasma Sputtered Ge2Sb2Se4Te as a Non-Volatile Optical Switch Material
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Phase-Change Memory Materials Processing Requirements
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Exploration of Alternative Hard Mask Materials for the IBE Patterning of 50nm Pitch STT-MRAM High Density Orthogonal Pillar Array
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BREAK
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Patterning Approaches for Integration of Complex Metal Alloys Towards Advanced Memory and Compute Applications
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Plasma Etch Challenges and Processing Optimization in Spin Logic Device Fabrication
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Effects of Bias Frequency on High Aspect Ratio Etching Using Voltage Waveform Tailoring
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Wafer Bevel Deposition by Localized SiO2 and Si3N4 PECVD and Application to 3D Integration
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Plasma Etching of Copper for the Microfabrication of High-Density Interconnects in Advanced Packaging
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PS2+ |
Selective Mask Deposition Using SiCl4 Plasma for a Highly Selective Etching Process
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On the Self-bias Voltages at Sintered Yttrium Oxyfluoride (Y-O-F) and Y2O3 During Plasma Irradiation and Their Etching Rates due to Ion Bombardment
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BREAK
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In-Plasma Photo-Assisted Etching of Si with Chlorine Aided by an External Vacuum Ultraviolet Source
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Etching of Silicon Dioxide (SiO2) Based on Remote Plasma-Based Functionalization and Electron Beam-Activation
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Investigation of Plasma-Surface Interactions During Plasma Enhanced Atomic Layer Deposition (PE-ALD) of Silicon Nitride Using in Situ Surface Chemistry Measurements
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Differences in Sidewall Chemistry for SiO2 and Si3N4 after Ar/HFC or Ar/FC Plasma Processing Using High Aspect Ratio Structures
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Significance of Plasma-Surface Interactions in the Etch Behavior of Low-k Materials
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Low Temperature Superpermeability in Metal Foils Exposed to Hydrogen Plasma
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SS+ |
Chemically Identifying Single Adatoms with Single-Bond Sensitivity During Oxidation Reactions of Borophene
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Tailoring the Interfacial Properties of 2D Transition Metal Silicates on Metal Supports
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Metal Oxide and Metal Dichalcogenide 2D Nanocrystals: Structure, Adsorption and Catalytic Properties
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BREAK
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Intercalated Cu2-xO Thin Film Confined Underneath Hexagonal Boron Nitride
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Imaging Surface Defects on MoS2
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Modifying 2D Transition Metal Dichalcogenides (TMDs) by Incorporating Excess Transition Metals
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SSD Flash Poster Session: Oral Presentations
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TF2+ |
Operando and High-throughput Approaches to Advance Integrated Process Technology of Atomically Thin Device Materials
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Versatile Synthesis of 2D Superlattices from Conversion of Sequentially Layered Sub-nanomater Metal Films
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Study of the Functionality of Spin Crossover Thin Films on the Ti3C2 Mxene Substrates
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BREAK
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AVS Thin Film Division/Graduate Student Harper Award TED-Talk Competition
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VT-TuA |
Design and Fabrication of Ultra-High Vacuum Test System for Quantitative Determination of Hydrogen Gettering and Permeation of Various Materials
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Gas Partial Pressure Measurement by Remote Plasma Optical Emission Spectroscopy & Automated Analysis Using Artificial Intelligence
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BREAK
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How Vacuum Controlled Venting Can Improve the Imagery of Electron Microscopy
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Novel Cylindrical Hot Cathode Ionisation Gauge
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High Performance Sealing In Extreme Environments
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