AVS 68 Session EM+MN+TF-ThM: Wide and Ultra Wide Band Gap Materials and Devices

Gallium oxide (Ga₂O₃) is attracting increased interest for electronics that can operate in extreme conditions, such as high power, high temperature and high radiation fluxes. This ultra-wide bandgap semiconductor has an interesting feature in that it exists in different phases, or polymorphs. β-Ga₂O₃ is thermodynamically stable at atmospheric conditions up to its melting point and is therefore the phase produced in melt-grown, single-crystal substrates.Epitaxial films of the other metastable polymorphs, however, are also of interest because they possess unique properties – such as high spontaneous polarization, ferroelectricity, or ferromagnetism – that could lead to new types of heterostructure devices.In this presentation we will summarize our results on the growth of epitaxial films of phase-pure vs. mixed-phase ε(κ), β, and γ-Ga₂O₃ using metal-organic chemical vapor deposition.We will focus on variables (temperature, triethylgallium (TEG) flow rate, and type of substrate) that have led to optimum control over the resulting polymorph and its microstructure, as characterized using x-ray diffraction (XRD), scanning electron microscopy, and high-resolution transmission electron microscopy (TEM).For example, for growth on (0001) sapphire substrates the phase composition of a 700-nm-thick epitaxial layer – from nominally 100% ε(κ) to 100% β-Ga₂O₃ – can be controlled by varying the substrate temperature (470 °C to 570 °C) and TEG flow rate (0.29 sccm to 2.1 sccm).We also show that nominally single-phase γ-Ga₂O₃ and β-Ga₂O₃ epitaxial films are produced under the same growth conditions (in the same growth run) by employing different substrates.High-resolution TEM and XRD ω-2θ and phi-scans suggest that the γ-Ga₂O₃ films are single crystal.

Amorphous metal oxide semiconductors exhibit promising properties such as high mobility at low deposition temperatures (< 400°C) and hence are widely investigated as channel materials for thin film transistors (TFT). The low processing temperature also enables their integration on the back-end-of-line (BEOL) of Si CMOS circuits for More-than-Moore applications. While amorphous Indium Gallium Zinc Oxide (IGZO) and Indium Zinc Oxide (IZO) are the most studied amorphous metal oxides for TFT applications, amorphous gallium oxide (a-GaO_x) is interesting due to its ultrawide bandgap (~4.9 eV) combined with the ability to control the carrier density by varying the oxygen content in it [1]. Thus, a-GaO_x has potential for high voltage TFT, sensing, and memristive device applications. There have been few reports of a-GaO_x TFTs with pulsed laser deposition or solution processing, yet a detailed study of TFTs featuring ALD based a-GaO_x channel has not been reported up to now.

Here TFTs with a-GaO_x channel deposited with plasma-enhanced atomic layer deposition (PE-ALD) are discussed. PE-ALD allows for relatively low deposition temperatures (~ 250°C), uniform and conformal films. We recently showed that the current through the a-GaO_x layer can be increased with shorter O₂ plasma exposure times during PE-ALD as it increases the number of sub bandgap defects in the oxide [2]. We present a detailed study of a-GaO_x back-gated TFTs deposited with short (1s) O₂ plasma times to obtain a conductive channel. We discuss the main device characteristics such as subthreshold slope (SS), threshold voltage and ON current and their dependence on the a-GaO_x channel length and thickness (22, 50, 75 nm) with 20 nm ALD Al₂O₃ as gate oxide. Transistors with SS < 150 mV/dec and an ON/OFF ratio of 10⁵ have been shown for a channel length of 6 µm. Impact of encapsulation of the GaO_x channel with in situ ALD-grown Al₂O₃ and ex situ PECVD-grown SiO₂ on the hysteresis in the transfer characteristics (drain current as a function of gate voltage) of the devices is investigated. A reduction of the hysteresis is achieved after in situ encapsulation of the devices with 2 nm Al₂O₃. Finally, the effect of post-metal annealing on the device performance is discussed.

[1] J. Kim et al. "Conversion of an ultra-wide bandgap amorphous oxide insulator to a semiconductor", NPG Asia Materials 9, e359 (2017)
[2] H. Kröncke et al., “Effect of O₂ plasma exposure time during atomic layer deposition of amorphous gallium oxide.” Journal of Vacuum Science & Technology A 39, 052408 (2021)

Mitigating these defects in wide band gap devices requires reliable characterization techniques suitable for large-scale device fabrication processes. Typical techniques used to characterize the density of interface states for gate dielectrics, such as the high-low method, require unconventionally large probing frequencies to account for fast trap states associated with wide-bandgap materials. The C-ψ_S technique is a quasi-static capacitance-voltage characterization method known for accurately determining surface potentials in MISCAP structures and has been rigorously demonstrated for SiC-based systems. For GaN systems, trap states located at the insulator/GaN interface or within the ALD-deposited dielectric may lead to dynamic charge/discharge processes that are less prevalent in SiC MIS structures with thermally grown oxides and thereby alter the C-ψ_S analysis. In this work, we successfully adapt the C-ψ_S analytical procedure to GaN-based MIS structures by imposing sensible mathematical conditions and accurately measure interface state densities and oxide charges for ALD-deposited gate dielectrics on n-GaN substrates. A range of post-deposition annealing temperatures is investigated to probe how processing conditions may alter defect states associated with alumina or silicon dioxide gate dielectrics. This work highlights recent progress in our endeavor to fabricate robust GaN-based high-power devices and establish reliable wide-bandgap device characterization procedures.

This work was supported by the DOE Vehicle Technologies Office Electric Drivetrain Consortium managed by Susan Rogers.

Sandia National Laboratories is a multimission laboratory managed and operated by National Technology & Engineering Solutions of Sandia, LLC, a wholly owned subsidiary of Honeywell International Inc., for the U.S. Department of Energy’s National Nuclear Security Administration under contract DE-NA0003525.