AVS1997 Session MS-TuA: Partnerships in R&D for Manufacturing Science
Tuesday, October 21, 1997 2:00 PM in Room J1/4
Tuesday Afternoon
Time Period TuA Sessions | Abstract Timeline | Topic MS Sessions | Time Periods | Topics | AVS1997 Schedule
Start | Invited? | Item |
---|---|---|
2:00 PM | Invited |
MS-TuA-1 Creating and Addressing the National Technology Roadmap for Semiconductors
J.A. Glaze (Semiconductor Industry Association) Since 1992, the Semiconductor Industry Association has sponsored the creation of the National Technology Roadmap for Semiconductors, now in preparation for a third edition. This document represents a broad consensus of industry, government, and university representatives on the technology needs of the semiconductor industry for the next 15 years. R&D addressing these needs is, in part, sponsored by industrial consortia and the U.S. government. A new initiative of the SIA to address the long-range needs of the Roadmap is the formation of research Focus Centers at universities. |
2:40 PM | Invited |
MS-TuA-3 The Industrial Consortium Approach to Precompetitive Semiconductor Research at Universities
R.K. Cavin (Semiconductor Research Corporation) In 1982, the SIA created the Semiconductor Research Corporation, an industrial consortium sponsoring semiconductor research at universities. In 1987, SEMATECH, the second U.S. semiconductor R&D consortium was formed. Today, MARCO, a wholly-owned subsidiary of the SRC, is being created to manage the new Focus Centers for the SIA. All three of these consortia will collaborate on creating, "narrowing," and, ultimately, implementing new concepts in semiconductor manufacturing technology. |
3:20 PM | Invited |
MS-TuA-5 University-Industry Partnerships in Competitive Manufacturing Technologies
N.A. Masnari (North Carolina State University) The Center for Advanced Electronic Materials Processing (AEMP) at North Carolina State University is a major initiative that merges an NSF Engineering Research Center (ERC) with SRC funded research programs and a SEMATECH Center of Excellence on Advanced Single Wafer Processing. The effective merging of these three entities into a single coordinated program is a prime example of how the integrated whole can exceed the sum of the individual parts. The richness of the research has led to the establishment of additional research programs at NC State supported by industry as well as research collaborations and joint experiments between industry researchers and university faculty and students. Another feature that has developed within AEMP is an increased emphasis on cross-disciplinary, team-oriented research that produces students who are better prepared for the industrial environment. The Center's organizational structure and fundamental approach to research and education have also resulted in the involvement of many undergraduate students in research and summer programs. Such experience better prepares students to enter the work force or to pursue graduate studies. The AEMP program has contributed to a new paradigm for collaborative university-industry-government research and education initiatives. The solution to problems and the development of future technologies requires that industry and universities work together. It is important to note that universities, in addition to providing well-educated manpower, are positioned to help US industry retain its competitive edge and compete in the global marketplace. |
4:00 PM | Invited |
MS-TuA-7 Government Sponsorship of Advanced Semiconductor Manufacturing Research
Z.J. Lemnios (Massachusetts Institute of Technology) Several agencies of the U.S. government have supported advanced research in semiconductor manufacturing. DARPA, in particular, has sponsored many such programs at both universities and industrial labs. Examples include the Microelectronics Manufacturing Science and Technology Program and several projects on advanced lithography. MIT, partly through its Lincoln Laboratory, has been involved in some of these approaches to lithography using very short wavelengths, from 193-nm DUV through x-ray. |