ALD2018 Session PS1-MoM: ALD Plenary Session

In the ever-changing world of ICT, due to the emergence of Internet of Things (IoT), big data, and the cloud, demand for Memory IC is growing exponentially. Therefore, in this session, development trend of two memory Ics, DRAM and NAND Flash memory, and the role of key technologies, ALD in particular, in the development of Memory IC will be discussed. In both DRAM and 3D NAND, technologies have continued to drive innovation. In DRAM, a remarkale progress has been made in technologies related to spacer pattering, cell transistor, and high-k cell capacitor. In 3D NAND, to overcome the challenge of stacking multiple layers, technologies related to etching holes/lines with high aspect ratio, increasing channel mobility, and achieving device reliability were developed. In developing such innovative technologies, ALD processes for SiO₂, high-k dielectric and metal made a considerable contribution, and the need for ALD processes for various materials is expected to rise. Currently, continued scaling is expected to be increasingly difficult as manufacturing processes become more difficult and manufacturing cost increases due to the rising number of process steps and decreasing equipment throughput. Therefore, considering such scaling challenges, productivity enhancement should be incorporated into developing current and future ALD technologies.

Semiconductor industry is at the point of the big conversion. It is crucial to find the right path to reply to market needs. Through a series of analysis on the evolution of patterning technology, new materials, and device structure it was reached to the conclusion that future scaling will be driven by the transition to complete vertical structure in conjunction with the geometrical scaling and new materials. Moreover, ALD technology will play a key role in the 3D structure fabrication and new material process. Wonik IPS, one of the frontiers of ALD equipment, has been focusing on ALD technology development since the successful introduction of high-volume-manufacturing ALD system in 1996. We are ready to provide various ALD solutions and try to do the right thing right for new ALD era.